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TC1187 Datasheet(PDF) 3 Page - Microchip Technology |
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TC1187 Datasheet(HTML) 3 Page - Microchip Technology |
3 / 20 page © 2007 Microchip Technology Inc. DS21353D-page 3 TC1070/TC1071/TC1187 VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.5V ADJ Input IADJ Adjust Input Leakage Current — 50 — pA ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 μF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions Note 1: 2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. 6: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ΔT |
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