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TC1055 Datasheet(PDF) 3 Page - Microchip Technology

No. de pieza TC1055
Descripción Electrónicos  50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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© 2007 Microchip Technology Inc.
DS21350D-page 3
TC1054/TC1055/TC1186
Output Noise
eN
260
nV/
√Hz IL = IOUTMAX
SHDN Input
SHDN Input High Threshold
VIH
45
%VIN VIN = 2.5V to 6.5V
SHDN Input Low Threshold
VIL
——
15
%VIN VIN = 2.5V to 6.5V
ERROR Output
Minimum VIN Operating Voltage
VINMIN
1.0
V
Output Logic Low Voltage
VOL
400
mV
1 mA Flows to ERROR
ERROR Threshold Voltage
VTH
0.95 x VR
—V
See Figure 4-2
ERROR Positive Hysteresis
VHYS
—50—
mV
Note 7
VOUT to ERROR Delay
tDELAY
—2.5
ms
VOUT falling from VR to VR - 10%
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations”, “Ther-
mal Considerations”, for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
9: Apply for junction temperatures of -40C to +85C.
TC VOUT = (VOUTMAX – VOUTMIN)x 106
VOUT x ΔT


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