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TC1055-5.0VCT713 Datasheet(PDF) 2 Page - Microchip Technology |
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TC1055-5.0VCT713 Datasheet(HTML) 2 Page - Microchip Technology |
2 / 18 page TC1054/TC1055/TC1186 DS21350D-page 2 © 2007 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage ....................................................................6.5V Output Voltage .....................................(-0.3V) to (VIN + 0.3V) Power Dissipation ......................... Internally Limited (Note 6) Maximum Voltage on Any Pin ...................VIN +0.3V to -0.3V Operating Junction Temperature Range .. -40°C < TJ < 125°C Storage Temperature.....................................-65°C to +150°C † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Input Operating Voltage VIN 2.7 — 6.0 V Note 8 Maximum Output Current IOUTMAX 50 100 150 — — — — — — mA TC1054 TC1055 TC1186 Output Voltage VOUT VR – 2.5% VR ±0.5% VR + 2.5% V Note 1 VOUT Temperature Coefficient TCVOUT — — 20 40 — — ppm/°C Note 2 Line Regulation ΔVOUT/ΔVIN —0.05 0.35 %(VR + 1V) ≤ VIN ≤ 6V Load Regulation: TC1054; TC1055 TC1186 ΔVOUT/VOUT — — 0.5 0.5 2 3 % (Note 3) IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX Dropout Voltage: TC1055; TC1186 TC1186 VIN-VOUT — — — — — 2 65 85 180 270 — — 120 250 400 mV IL = 100 µA IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 4) Supply Current IIN —50 80 µA SHDN = VIH, IL = 0 µA (Note 9) Shutdown Supply Current IINSD — 0.05 0.5 µA SHDN = 0V Power Supply Rejection Ratio PSRR — 64 — dB f ≤ 1kHz Output Short Circuit Current IOUTSC — 300 450 mA VOUT = 0V Thermal Regulation ΔVOUT/ΔPD —0.04 — V/W Notes 5, 6 Thermal Shutdown Die Temperature TSD — 160 — °C Thermal Shutdown Hysteresis ΔTSD —10— °C Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations”, “Ther- mal Considerations”, for more details. 7: Hysteresis voltage is referenced by VR. 8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40C to +85C. TC VOUT = (VOUTMAX – VOUTMIN)x 106 VOUT x ΔT |
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