MICROCIRCUIT DATA SHEET

MNLM1575-12-X REV 0D1

(Absolute Maximum Ratings)

(Note 1)

Maximum Supply Voltage

45V

ON/OFF Pin Input Voltage

-0.3V <V< +Vin

Output Voltage to Ground

-1V

(Steady State)

Power Dissipation

(Note 2, 3)

Internally Limited

Storage Temperature Range

-65 C < Ta < +150 C

Lead Temperature

(Soldering, 10 seconds)

300 C

METAL CAN

260 C

CERDIP

260 C

CERAMIC SOIC

Maximum Junction Temperature

150 C

Thermal Resistance

ThetaJA

45 C/W

METAL CAN

(Still Air)

10 C/W

(500LF/Min Air flow)

70 C/W

CERDIP

(Still Air)

33 C/W

(500LF/Min Air flow)

121 C/W

CERAMIC SOIC (Still Air)

73 C/W

(500LF/Min Air flow)

ThetaJC

(Note 3)

3.3 C/W

METAL CAN

2.0 C/W

CERDIP (Note 3 applicable to this Pkg only)

3.0 C/W

CERAMIC SOIC

Package Weight

(Typical)

TBD

METAL CAN

TBD

CERDIP

TBD

CERAMIC SOIC

ESD Tolerance

(Note 4)

3000V

Note 1:

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.

Operating Ratings indicate conditions for which the device is functional, but do not

guarantee specific performance limits. For guaranteed specifications and test

conditions, see the Electrical Characteristics. The guaranteed specifications apply

only for the test conditions listed. Some performance characteristics may degrade

when the device is not operated under the listed test conditions.

Note 2:

The maximum power dissipation must be derated at elevated temperatures and is

dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to

ambient thermal resistance), and TA (ambient temperature). The maximum allowable

power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number

given in the Absolute Maximum Ratings, whichever is lower.

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