PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

LM237KC

NRND

TO-220

KC

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM237KCE3

NRND

TO-220

KC

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM237KCSE3

ACTIVE

TO-220

KCS

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM237KTER

OBSOLETE

PFM

KTE

3

TBD

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LM337KC

NRND

TO-220

KC

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM337KCE3

NRND

TO-220

KC

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM337KCSE3

ACTIVE

TO-220

KCS

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM337KTER

NRND

PFM

KTE

3

2000

TBD

CU SN

Level-3-240C-168 HR

LM337KTPR

NRND

PFM

KTP

2

3000 Green (RoHS &

no Sb/Br)

CU SN

Level-1-260C-UNLIM

LM337KTPRG3

NRND

PFM

KTP

2

3000 Green (RoHS &

no Sb/Br)

CU SN

Level-1-260C-UNLIM

LM337KTTR

ACTIVE

DDPAK/

TO-263

KTT

3

500

Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

LM337KTTRG3

ACTIVE

DDPAK/

TO-263

KTT

3

500

Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

LM337KVURG3

ACTIVE

PFM

KVU

3

2500 Green (RoHS &

no Sb/Br)

CU SN

Level-3-260C-168 HR

LM337Y

OBSOLETE

DIESALE

Y

0

TBD

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2007

Addendum-Page 1