www.lansdale.com

Page 8 of 8

Issue A

LANSDALE Semiconductor, Inc.

ML1490

P DIP = PP

PLASTIC P

(ML1490PP)

ACKAGE

CASE 626–05

ISSUE K

OUTLINE DIMENSIONS

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

14

5

8

F

NOTE 2

–A–

–B–

–T–

SEATING

PLANE

H

J

G

D

K

N

C

L

M

M

A

M

0.13 (0.005)

T

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

9.40

10.16

0.370

0.400

B

6.10

6.60

0.240

0.260

C

3.94

4.45

0.155

0.175

D

0.38

0.51

0.015

0.020

F

1.02

1.78

0.040

0.070

G

2.54 BSC

0.100 BSC

H

0.76

1.27

0.030

0.050

J

0.20

0.30

0.008

0.012

K

2.92

3.43

0.115

0.135

L

7.62 BSC

0.300 BSC

M

–––

–––

N

0.76

1.01

0.030

0.040

Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-

ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s

technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.