TC1202
TRANSCOM, INC., 90 Dasoong 7
th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
22
SMALL SIGNAL MODEL, VDS = 4 V, IDS = 25 mA
Cgs
Cgd
Cds
Rg
Rd
Rds
Ri
Rs
Gm
T
Lg
Ld
Ls
PARAMETERS
Parameters
Parameters
Lg
0.04473 nH
Rs
1.12 Ohm
Rg
0.79 Ohm Ls
0.0005 nH
Cgs
0.361 pF
Cds
0.0838 pF
Ri
1.47 Ohm Rds
193.0 Ohm
Cgd
0.0310 pF
Rd
0.920 Ohm
Gm
94.9 mS
Ld
0.0242 nH
T
2.13 psec
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290
°C ± 5°C; Handling Tool:
Tweezers; Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220
°C to 250°C; Bond Tip Temperature: 150°C; Bond
Force: 20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at
all stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
SCHEMATIC