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TLC5942RHBT Datasheet(PDF) 3 Page - Texas Instruments |
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TLC5942RHBT Datasheet(HTML) 3 Page - Texas Instruments |
3 / 33 page www.ti.com RECOMMENDED OPERATING CONDITIONS DISSIPATION RATINGS TLC5942 SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007 At TA= –40°C to +85°C, unless otherwise noted. TLC5942 PARAMETER TEST CONDITIONS MIN NOM MAX UNIT DC Characteristics: VCC = 3 V to 5.5 V VCC Supply voltage 3.0 5.5 V VO Voltage applied to output OUT0 to OUT15 17 V VIH High-level input voltage 0.7 × VCC VCC V VIL Low-level input voltage GND 0.3 × VCC V IOH High-level output current GSSOUT, DCSOUT –1 mA IOL Low-level output current GSSOUT, DCSOUT 1 mA IOLC Constant output sink current OUT0 to OUT15 50 mA TA Operating free-air temperature –40 +85 °C Operating junction TJ –40 +125 °C temperature AC Characteristics: VCC = 3 V to 5.5 V fCLK (dcsclk) Data shift clock frequency DCSCLK 30 MHz Data shift/grayscale control fCLK (gssclk) GSSCLK 30 MHz clock frequency GSSCLK (see Figure 9), TWH0 / TWL0 10 ns DCSCLK (see Figure 10) Pulse duration XGSLAT, BLANK (see Figure 9), TWH1 30 ns XDCLAT (see Figure 10) GSSIN–GSSCLK ↑ (see Figure 9), TSU0 3 ns DCSIN–DCSCLK ↑ (see Figure 10) BLANK ↓– GSSCLK ↑ TSU1 10 ns (see Figure 9) XGSLAT ↑ – GSSCLK↑ Setup time (see Figure 9), TSU2 100 ns XDCLAT ↑ – DCSCLK↑ (see Figure 10) XGSLAT ↓ – GSSCLK↑ TSU3 15 ns (see Figure 9 and Figure 11) GSSIN–GSSCLK ↑ (see Figure 9), TH0 3 ns DCSIN–DCSCLK ↑ (see Figure 10) XGSLAT ↑ – GSSCLK↑ Hold time (see Figure 9), TH1 30 ns XDCLAT ↑ – DCSCLK↑ (see Figure 10) DERATING FACTOR TA < +25°C TA = +70°C TA = +85°C PACKAGE ABOVE TA = +25°C POWER RATING POWER RATING POWER RATING HTSSOP-28 with 31.67 mW/ °C 3958 mW 2533 mW 2058 mW PowerPAD soldered(1) HTSSOP-28 with 16.21 mW/ °C 2026 mW 1296 mW 1053 mW PowerPAD not soldered(2) QFN-32(3) 27.86 mW/ °C 3482 mW 2228 mW 1811 mW (1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available for download at www.ti.com). (2) With PowerPAD not soldered onto copper area on PCB. (3) The package thermal impedance is calculated in accordance with JESD51-5. Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TLC5942 |
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