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RECOMMENDED OPERATING CONDITIONS

DISSIPATION RATINGS

TLC5942

SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007

TLC5942

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

DC Characteristics: VCC = 3 V to 5.5 V

VCC

Supply voltage

3.0

5.5

V

Voltage applied to output

OUT0 to OUT15

17

V

High-level input voltage

0.7

× VCC

VCC

V

Low-level input voltage

GND

0.3

× VCC

V

High-level output current

GSSOUT, DCSOUT

–1

mA

Low-level output current

GSSOUT, DCSOUT

1

mA

Constant output sink current

OUT0 to OUT15

50

mA

Operating free-air temperature

–40

+85

°C

Operating junction

–40

+125

°C

temperature

AC Characteristics: VCC = 3 V to 5.5 V

Data shift clock frequency

DCSCLK

30

MHz

Data shift/grayscale control

GSSCLK

30

MHz

clock frequency

GSSCLK (see Figure 9),

10

ns

DCSCLK (see Figure 10)

Pulse duration

XGSLAT, BLANK (see Figure 9),

30

ns

XDCLAT (see Figure 10)

GSSIN–GSSCLK

↑ (see Figure 9),

3

ns

DCSIN–DCSCLK

↑ (see Figure 10)

BLANK

↓– GSSCLK ↑

10

ns

(see Figure 9)

XGSLAT

↑ – GSSCLK↑

Setup time

(see Figure 9),

100

ns

XDCLAT

↑ – DCSCLK↑

(see Figure 10)

XGSLAT

↓ – GSSCLK↑

15

ns

(see Figure 9 and Figure 11)

GSSIN–GSSCLK

↑ (see Figure 9),

3

ns

DCSIN–DCSCLK

↑ (see Figure 10)

XGSLAT

↑ – GSSCLK↑

Hold time

(see Figure 9),

30

ns

XDCLAT

↑ – DCSCLK↑

(see Figure 10)

DERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

HTSSOP-28 with

31.67 mW/

°C

3958 mW

2533 mW

2058 mW

HTSSOP-28 with

16.21 mW/

°C

2026 mW

1296 mW

1053 mW

27.86 mW/

°C

3482 mW

2228 mW

1811 mW

(1)

With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available

for download at www.ti.com).

(2)

With PowerPAD not soldered onto copper area on PCB.

(3)

The package thermal impedance is calculated in accordance with JESD51-5.

Copyright © 2007, Texas Instruments Incorporated

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