2.5-6.0/5.0-12.0 GHz GaAs MMIC

Active Doubler

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Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

July 2007 - Rev 27-Jul-07

X1002-BD

Handling and Assembly Information

Ordering Information

CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the

environment. For safety, observe the following procedures:

• Do not ingest.

• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-

products are dangerous to the human body if inhaled, ingested, or swallowed.

• Observe government laws and company regulations when discarding this product.This product must be discarded in accordance

with methods specified by applicable hazardous waste procedures.

Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or

systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life

support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain

life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or

system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic

containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need

careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.

Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to

enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should

be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured

in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the

die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy

Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately

provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin

eutectic (80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work station

temperature should be 310º C +/- 10º C. Exposure to these extreme temperatures should be kept to minimum. The collet should be

heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during

placement.

Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond

pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%

elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias

connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may

be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds

should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.

Part Number for Ordering

Description

XX1002-BD-000V

“V” - vacuum release gel paks

XX1002-BD-EV1

XX1002 die evaluation module