Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

9

Pilot Datasheet v2.5

FMA3009

It is recommended that the RF connections be made using bond wires with 25µm diameter and a

maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for

bond wire inductance, with the addition of a microstrip transformer, shown in the diagram below.

Ground connections should be made according to the required bias conditions.

Substrate: Alumina

Thickness: 635µm

Dimensions in mm

Transformer Impedance 41

Ω

Electrical Length 32º at 10GHz

All RF tracks should be 50

Ω characteristic material

Capacitor, 100pF, chip capacitor

Capacitor, 100nF, 0402

6 nH – 3.5 Turn Air Coil (Manufacturer: Sycopel, model: HMG/3.5/500/50/100)

To Evaluation Board via an 0402

Surface Mounted capacitor (100nF)

100pF Chip Capacitor

VDD

100pF

100nF

RF Output

RF Input

1.0

1.0

0.9

0.9

0.61

0.61

Ground Connections

3.5 Turn Air Coil