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AD8016ARB Datasheet(PDF) 4 Page - Analog Devices |
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AD8016ARB Datasheet(HTML) 4 Page - Analog Devices |
4 / 20 page REV. B AD8016 –4– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V Internal Power Dissipation PSOP3 Package 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 W SO-Batwing Package 3 . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W TSSOP-EP Package 4 . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . . ±V S Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . ±VS Output Short-Circuit Duration . . . . . . . . . . . . . . . . . . . .Observe Power Derating Curves Storage Temperature Range . . . . . . . . . . . . . –65 °C to +125°C Operating Temperature Range . . . . . . . . . . . . –40 °C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device on a 4-layer board with 10 inches2 of 1 oz. copper at 85 °C 20-lead PSOP3 package: θ JA = 18 °C/W. 3Specification is for device on a 4-layer board with 10 inches2 of 1 oz. copper at 85 °C 24-lead Batwing package: θ JA = 28 °C/W. 4Specification is for device on a 4-layer board with 9 inches2 of 1 oz. copper at 85 °C 28-lead (TSSOP-EP) package: θ JA = 29 °C/W. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8016 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated device is determined by the glass transition temperature of the plastic, approximately 150 °C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. The output stage of the AD8016 is designed for maximum load current capability. As a result, shorting the output to common can cause the AD8016 to source or sink 2000 mA. To ensure proper operation, it is necessary to observe the maximum power derating curves. Direct connection of the output to either power supply rail can destroy the device. AMBIENT TEMPERATURE ( C) 7 0 6 5 4 3 2 1 0 10 20 30 40 50 60 70 80 90 PSOP3 SO-BATWING 8 TSSOP-EP Figure 2. Maximum Power Dissipation vs. Temperature for AD8016 for TJ = 125 °C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8016 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Temperature Package Package Model Range Description Option AD8016ARP –40 °C to +85°C 20-Lead PSOP3 RP-20A AD8016ARP-REEL –40 °C to +85°C 20-Lead PSOP3 RP-20A AD8016ARP-EVAL Evaluation Board AD8016ARB –40 °C to +85°C 24-Lead SO-Batwing RB-24 AD8016ARB-REEL –40 °C to +85°C 24-Lead SO-Batwing RB-24 AD8016ARB-EVAL Evaluation Board AD8016ARE –40 °C to +85°C 28-Lead TSSOP-EP RE-28-1 AD8016ARE-REEL –40 °C to +85°C 28-Lead TSSOP-EP RE-28-1 AD8016ARE-REEL7 –40 °C to +85°C 28-Lead TSSOP-EP RE-28-1 AD8016ARE-EVAL Evaluation Board |
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