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AD8016ARB Datasheet(PDF) 4 Page - Analog Devices

No. de pieza AD8016ARB
Descripción Electrónicos  Low Power, High Output Current xDSL Line Driver
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD8016ARB Datasheet(HTML) 4 Page - Analog Devices

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REV. B
AD8016
–4–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V
Internal Power Dissipation
PSOP3 Package
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 W
SO-Batwing Package
3
. . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W
TSSOP-EP Package
4
. . . . . . . . . . . . . . . . . . . . . . . .
1.4 W
Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .
±V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .
±VS
Output Short-Circuit Duration
. . . . . . . . . . . . . . . . . . . .Observe Power Derating Curves
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +125°C
Operating Temperature Range . . . . . . . . . . . . –40
°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device on a 4-layer board with 10 inches2 of 1 oz. copper at 85
°C
20-lead PSOP3 package:
θ
JA = 18
°C/W.
3Specification is for device on a 4-layer board with 10 inches2 of 1 oz. copper at 85
°C
24-lead Batwing package:
θ
JA = 28
°C/W.
4Specification is for device on a 4-layer board with 9 inches2 of 1 oz. copper at 85
°C
28-lead (TSSOP-EP) package:
θ
JA = 29
°C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8016
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
device is determined by the glass transition temperature of the
plastic, approximately 150
°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
The output stage of the AD8016 is designed for maximum load
current capability. As a result, shorting the output to common
can cause the AD8016 to source or sink 2000 mA. To ensure
proper operation, it is necessary to observe the maximum power
derating curves. Direct connection of the output to either power
supply rail can destroy the device.
AMBIENT TEMPERATURE ( C)
7
0
6
5
4
3
2
1
0
10
20
30
40
50
60
70
80
90
PSOP3
SO-BATWING
8
TSSOP-EP
Figure 2. Maximum Power Dissipation vs.
Temperature for AD8016 for TJ = 125
°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8016 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option
AD8016ARP
–40
°C to +85°C
20-Lead PSOP3
RP-20A
AD8016ARP-REEL
–40
°C to +85°C
20-Lead PSOP3
RP-20A
AD8016ARP-EVAL
Evaluation Board
AD8016ARB
–40
°C to +85°C
24-Lead SO-Batwing
RB-24
AD8016ARB-REEL
–40
°C to +85°C
24-Lead SO-Batwing
RB-24
AD8016ARB-EVAL
Evaluation Board
AD8016ARE
–40
°C to +85°C
28-Lead TSSOP-EP
RE-28-1
AD8016ARE-REEL
–40
°C to +85°C
28-Lead TSSOP-EP
RE-28-1
AD8016ARE-REEL7
–40
°C to +85°C
28-Lead TSSOP-EP
RE-28-1
AD8016ARE-EVAL
Evaluation Board


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