High Power LED

TSLG-XR8080-A08L

②

Special thermal designs are also recommended to take in outer heat sink design, such as FR4

PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.

③

Sufficient thermal management must be conducted, or the die junction temperature will be over

the limit under large electronic driving and LED lifetime will decrease critically.

4. Assembly process flow

Thermal conductive glue dispensing

Recommended material and its

supplier: EpoTek T7109 from Epoxy

Technology

LED emitter placement

Hot bar soldering of LED emitter

Note: The MCPCB should be preheated up to

40°C for increasing the solderability

Functional test of LED emitter

Curing of thermal conductive glue

Rev. A/JY

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