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STP2NC70ZFP Datasheet(PDF) 2 Page - STMicroelectronics |
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STP2NC70ZFP Datasheet(HTML) 2 Page - STMicroelectronics |
2 / 13 page STP2NC70Z, STP2NC70ZFP, STD1NC70Z, STD1NC70Z-1 2/13 ABSOLUTE MAXIMUM RATINGS ( l) Pulse width limited by safe operating area (1) ISD ≤10A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX. (*) Limited only by maximum temperature allowed THERMAL DATA AVALANCHE CHARACTERISTICS GATE-SOURCE ZENER DIODE Note: 3. ∆VBV = αT (25°-T) BVGSO(25°) (#) When mounted on minimum Footprint PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and cost- effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Symbol Parameter Value Unit STP2NC70Z STP2NC70ZFP STD1NC70Z STD1NC70Z-1 VDS Drain-source Voltage (VGS = 0) 700 V VDGR Drain-gate Voltage (RGS = 20 kΩ) 700 V VGS Gate- source Voltage ± 25 V ID Drain Current (continuos) at TC = 25°C 1.4 1.4 (*) 1.4 A ID Drain Current (continuos) at TC = 100°C 0.9 0.9 (*) 0.9 A IDM (l) Drain Current (pulsed) 5.6 5.6 (*) 5.6 A PTOT Total Dissipation at TC = 25°C 50 25 45 W Derating Factor 0.4 0.2 0.36 W/°C IGS Gate-source Current (DC) ± 50 mA VESD(G-S) Gate source ESD(HBM-C=100pF, R=1.5K Ω) 2000 V dv/dt (1) Peak Diode Recovery voltage slope 3 V/ns VISO Insulation Withstand Voltage (DC) - 2500 - V Tj Tstg Operating Junction Temperature Storage Temperature -65 to 150 -65 to 150 °C °C TO-220 TO-220FP DPAK IPAK Rthj-case Thermal Resistance Junction-case Max 2.5 5 2.75 °C/W Rthj-pcb Thermal Resistance Junction-pcb Max (for SMD) (#) 100 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 62.5 100 °C/W Tl Maximum Lead Temperature For Soldering Purpose 300 275 °C Symbol Parameter Max Value Unit IAR Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) 1.4 A EAS Single Pulse Avalanche Energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 60 mJ Symbol Parameter Test Conditions Min. Typ. Max. Unit BVGSO Gate-Source Breakdown Voltage Igs=± 1mA (Open Drain) 25 V αT Voltage Thermal Coefficient T=25°C Note(3) 1.3 10-4/°C |
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