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IRF840STRLPBF Datasheet(PDF) 1 Page - Vishay Siliconix

No. de pieza IRF840STRLPBF
Descripción Electrónicos  Power MOSFET
Download  8 Pages
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Fabricante Electrónico  VISHAY [Vishay Siliconix]
Página de inicio  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

IRF840STRLPBF Datasheet(HTML) 1 Page - Vishay Siliconix

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Document Number: 91071
www.vishay.com
S-81432-Rev. A, 07-Jul-08
1
Power MOSFET
IRF840S, SiHF840S
Vishay Siliconix
FEATURES
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirement
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
device
design,
low
on-resistance
and
cost-effectiveness.
The SMD-220 is a surface mount power package capable of
accommodating die size up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The SMD-220 is
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0 W
in a typical surface mount application.
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 14 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
PRODUCT SUMMARY
VDS (V)
500
RDS(on) (Ω)VGS = 10 V
0.85
Qg (Max.) (nC)
63
Qgs (nC)
9.3
Qgd (nC)
32
Configuration
Single
N-Channel MOSFET
G
D
S
D2PAK (TO-263)
G D
S
Available
RoHS*
COMPLIANT
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
D2PAK (TO-263)
Lead (Pb)-free
IRF840SPbF
IRF840STRLPbFa
IRF840STRRPbFa
SiHF840S-E3
SiHF840STL-E3a
SiHF840STR-E3a
SnPb
IRF840S
IRF840STRaL
IRF840STRa
SiHF840S
SiHF840STLa
SiHF840STRa
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDS
500
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current
VGS at 10 V
TC = 25 °C
ID
8.0
A
TC = 100 °C
5.1
Pulsed Drain Currenta
IDM
32
Linear Derating Factor
1.0
W/°C
Linear Derating Factor (PCB Mount)e
0.025
Single Pulse Avalanche Energyb
EAS
510
mJ
Avalanche Currenta
IAR
8.0
A
Repetiitive Avalanche Energya
EAR
13
mJ
Maximum Power Dissipation
TC = 25 °C
PD
125
W
Maximum Power Dissipation (PCB Mount)e
TA = 25 °C
3.1
Peak Diode Recovery dV/dtc
dV/dt
3.5
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature)
for 10 s
300d
* Pb containing terminations are not RoHS compliant, exemptions may apply


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