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SI5509DC Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI5509DC Datasheet(HTML) 1 Page - Vishay Siliconix |
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1 / 12 page  FEATURES D TrenchFETr Power MOSFETs APPLICATIONS D Complementary MOSFET for Portable Devices – Ideal for Buck–Boost Circuits RoHS COMPLIANT Si5509DC Vishay Siliconix New Product Document Number: 73629 S–60417—Rev. A, 20-Mar-06 www.vishay.com 1 N- and P-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) Qg (Typ) N Channel 20 0.052 at VGS = 4.5 V 6.1a 39nc N-Channel 20 0.084 at VGS = 2.5 V 4.8a 3.9 nc P Channel 20 0.090 at VGS = –4.5 V –4.8a 38nc P-Channel –20 0.160 at VGS = –2.5 V –3.6a 3.8 nc Ordering Information: Si5509DC-T1–E3 (Lead (Pb)–Free) N-Channel MOSFET D1 G1 S1 S2 G2 D2 P-Channel MOSFET Marking Code ED XXX Lot Traceability and Date Code Part # Code Bottom View 1206-8 ChipFET r S1 G1 S2 G2 D1 D1 D2 D2 1 ABSOLUTE MAXIMUM RATINGS (TA = 25 _C UNLESS OTHERWISE NOTED) Parameter Symbol N-Channel P-Channel Unit Drain-Source Voltage VDS 20 –20 V Gate-Source Voltage VGS "12 V TC = 25 _C 6.1a –4.8a Continuous Drain Current (TJ = 150 _C) TC = 70 _C ID 4.9a –3.8a Continuous Drain Current (TJ = 150 _C) TA = 25 _C ID 5.0b, c –3.9b, c TA = 70 _C 3.9b, c –3.1b, c A Pulsed Drain Current IDM 10 –15 A Source Drain Current Diode Current TC = 25 _C IS 3.7 –3.7 Source-Drain Current Diode Current TA = 25 _C IS 1.7b, c –1.7b, c TC= 25 _C 4.5 4.5 Maximum Power Dissipation TC= 70 _C PD 2.88 2.88 W Maximum Power Dissipation TA = 25 _C PD 2.1b, c 2.1b, c W TA = 70 _C 1.33b, c 1.33b, c Operating Junction and Storage Temperature Range TJ, Tstg –55 to 150 _C Soldering Recommendations (Peak Temperature)d, e 260 _C THERMAL RESISTANCE RATINGS N-Channel P-Channel Parameter Symbol Typ Max Typ Max Unit Maximum Junction-to-Ambientb, f t v 5 sec RthJA 50 60 50 60 _C/W Maximum Junction-to-Foot (Drain) Steady-State RthJF 30 40 30 40 _C/W Notes a. Based on TC = 25 _C. b. Surface Mounted on 1” x 1” FR4 Board. c. t = 5 sec d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 90 _C/W for both channels. |
Número de pieza similar - SI5509DC_08 |
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Descripción similar - SI5509DC_08 |
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