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ULN2066B Datasheet(PDF) 5 Page - STMicroelectronics |
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ULN2066B Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page MOUNTING INSTRUCTIONS The Rth j-amb can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 12) or to an external heatsink (Fig. 13). The diagram of Figure 14 shows the maximum dis- sipable power Ptot and the Rth j-amb as a function of the side ” α” of two equal square copper areas hav- ing a thickness of 35 µ (1.4mils). During soldering the pins temperature must not ex- ceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 12 : Example of P.C. Board Area which is Used as Heatsink. Figure 13 : External Heatsink Mounting Example. Figure 14 : Maximum Dissipable Power and Junc- tion to Ambient Thermal Resistance vs. Side ” α”. Figure 15 : Maximum Allowable Power Dissipa- tion vs. Ambient Temperature. ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B 5/8 |
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