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TC1070 Datasheet(PDF) 11 Page - TelCom Semiconductor, Inc

No. de pieza TC1070
Descripción Electrónicos  50mA ADJUSTABLE CMOS LDO WITH SHUTDOWN
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Fabricante Electrónico  TELCOM [TelCom Semiconductor, Inc]
Página de inicio  http://www.telcom-semi.com
Logo TELCOM - TelCom Semiconductor, Inc

TC1070 Datasheet(HTML) 11 Page - TelCom Semiconductor, Inc

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TC1071
5
PRELIMINARY INFORMATION
TC1071-01
6/13/97
100mA ADJUSTABLE CMOS
LDO WITH SHUTDOWN
Equation 2 can be used in conjunction with Equation 3
to ensure regulator thermal operation is within limits. For
example:
Given:
VIN
MAX = 3.0V ±10%
VOUT
MIN = 2.7V ±0.5V
ILOAD = 98mA
TAMAX = 55°C
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]40 x 10–3
= 60mW
Maximum allowable power dissipation:
PD
MAX = (TJMAX – TAMAX)
θJA
= (125 – 55)
220
= 318mW
In this example, the TC1071 dissipates a maximum of
only 60mW; far below the allowable limit of 318mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 318mW
into Equation 1, from which VINMAX = 5.9V.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a ground
plane, wide traces at the pads, and wide power supply bus
lines combine to lower
θJA and therefore increase the
maximum allowable power dissipation limit.


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