IN-LINE COUPLERS

ILC-3F-2.14G

MULTI-MIX

The Multi-Mix

high isolation, and high power handling in a small outline. The ILC series are composed of serial con-

nected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is

maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of

the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do

not. Accurate phase and amplitude balance make them ideal for applications involving power

amplifiers, signal distribution and processing.

ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical

performance that is superior to conventional adhesive bonding techniques.

The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless

applications. The high stability ceramic filled PTFE dielectrics utilized in these components are

compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground

plane provides excellent EM shielding.

Additional benefits include:

• Cost effective for commercial wireless applications

• Operating temperature range –55°C to +85°C.

• Can be integrated with other Multi-Mix

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in,

Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and

Thermal Cycling Life Test (>1000 cycles).

THE MULTI-MIX

Multi-Mix

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous

monolithic structure with superior performance at microwave and millimeter wave frequencies. The

bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and

plated-through vias to form a SMD module that requires no additional packaging and is suitable for

automated assembly.

TECHNICAL DESCRIPTION / APPLICATION

• 2.04 - 2.24 GHz

• LOW LOSS

• LOW VSWR

• HIGH ISOLATION

• SURFACE MOUNT

REV: 002, 06/28/02

THE MULTI-MIX MICROTECHNOLOGY

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

AVAILABLE ON

TAPE & REEL

U.S. patent 6,099,677 and other patents pending.