TLV1393 datasheet(4/16 Pages) TI | DUAL DIFFERENTIAL COMPARATORS

Nombre de pieza

Descripción

TLV1393

DUAL DIFFERENTIAL COMPARATORS ( 16 Page)

4 page

TLV1393, TLV1393Y, TLV2393, TLV2393Y

DUAL DIFFERENTIAL COMPARATORS

SLCS121A – AUGUST 1993 – REVISED APRIL 1994

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLV1393Y chip information

This chip, when properly assembled, displays characteristics similar to the TLV1393. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 13 TYPICAL

BONDING PADS: 3.54

× 3.54 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

–

1OUT

1IN +

1IN –

VCC

(8)

(6)

(3)

(2)

(5)

(1)

–

(7)

2IN +

2IN –

2OUT

(4)

GND

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

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