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TPS2201DF Datasheet(PDF) 3 Page - Texas Instruments |
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TPS2201DF Datasheet(HTML) 3 Page - Texas Instruments |
3 / 23 page TPS2201, TPS2201Y DUAL-SLOT PC CARD POWER-INTERFACE SWITCHES FOR PARALLEL PCMCIA CONTROLLERS SLVS094B – AUGUST 1994 – REVISED AUGUST 1995 6–3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS2201Y chip information This chip, when properly assembled, displays characteristics similar to the TPS2201. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS 204 142 TPS2201Y (2) (28) (1) (3) (29) (30) (27) (4) 5V 5V 5V A_VPP_PGM A_VPP_VCC B_VPP_PGM B_VPP_VCC B_VCC5 (6) (5) (7) (8) A_VCC5 A_VCC3 12V AVPP (10) (9) (11) (12) AVCC AVCC AVCC GND (14) (13) (15) APWR_GOOD SHDN 3V (24) (25) (26) (23) B_VCC3 VDD 12V BVPP (20) (21) (22) (19) BVCC BVCC BVCC BPWR_GOOD (16) (17) (18) OC 3V 3V (2) (1) (3) (4) (6) (5) (7) (8) (10) (9) (11) (12) (14) (13) (15) (20) (21) (22) (19) (16) (17) (18) (28) (29) (30) (27) (24) (25) (26) (23) |
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