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TC2055-2.85VCTTR Datasheet(PDF) 4 Page - Microchip Technology |
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TC2055-2.85VCTTR Datasheet(HTML) 4 Page - Microchip Technology |
4 / 22 page TC2054/2055/2186 DS21663D-page 4 © 2009 Microchip Technology Inc. TEMPERATURE CHARACTERISTICS Thermal Regulation ΔV OUT/ΔPD —0.04 — V/W Note 8 Thermal Shutdown Die Temperature TSD — 160 — °C Output Noise eN — 600 — nV / √Hz IL = IOUT MAX , F = 10 kHz Response Time (from Shutdown Mode) tR —60 — µs VIN = 4V CIN = 1 µF, COUT = 10 µF IL = 0.1 mA, Note 11 SHDN Input SHDN Input High Threshold VIH 60 — — %VIN VIN = 2.5V to 6.0V SHDN Input Low Threshold VIL —— 15 %VIN VIN = 2.5V to 6.0V ERROR OUTPUT Minimum VIN Operating Voltage VINMIN 1.0 — — V IOL = 0.1 mA Output Logic Low Voltage VOL — — 400 mV 1 mA Flows to ERROR, IOL = 1 mA, VIN = 2V ERROR Threshold Voltage VTH — 0.95 x VR — V See Figure 4-2 ERROR Positive Hysteresis VHYS —50 — mV Note 10 VOUT to ERROR Delay tDELAY —2 — ms VOUT from VR = 3V to 2.8V Resistance from ERROR to GND RERROR — 126 — Ω VDD = 2.5V, VOUT = 2.5V Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND. Parameters Sym Min Typ Max Units Conditions Temperature Ranges: Extended Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances: Thermal Resistance, 5L-SOT-23 θ JA — 255 — °C/W ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. BOLDFACE type specifications apply for junction temperature of -40°C to +125°C. Parameter Sym Min Typ Max Units Conditions Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V. 3: TCVOUT = 4: 5: 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms. 9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem- perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). 10: Hysteresis voltage is referenced by VR. 11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN. V OUTMAX V OUTMIN – () 10 6 × V OUT ΔT × ----------------------------------------------------------------------------------------- |
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