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TPS2501DRCT Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza TPS2501DRCT
Descripción Electrónicos  INTEGRATED USB POWER SWITCH WITH BOOST CONVERTER
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS2501DRCT Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPS2500, TPS2501
SLVS886A – OCTOBER 2008 – REVISED AUGUST 2009................................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
Eco-mode™
DEVICE
TEMPERATURE(2)
PACKAGE
MARKING
Control Scheme
TPS2500
Enabled
CHO
–40°C to 85°C
DRC (SON)
TPS2501
Disabled
OBA
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2)
Maximum ambient temperature is a function of device junction temperature and system-level considerations, such as power dissipation
and board layout. See Dissipation Ratings and Recommended Operating Conditions for specific information related to these devices.
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
Input voltage range on SW, AUX, IN, USB, ENUSB, EN, FAULT, ILIM
–0.3 to 7
V
FAULT sink current
25
mA
ILIM source current
1
mA
TJ
Junction temperature range
–40 to 150
°C
ESD – HBM
2
kV
ESD – CDM
500
V
ESD – system level (contact/air)(2)
8/15
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2500EVM (HPA337) evaluation module
(documentation available on the Web). These were the test levels, not the failure threshold.
THERMAL RESISTANCE(2)
THERMAL RESISTANCE
TA ≤ 25°C
PACKAGE
θ
JA
θ
JC
POWER RATING
DRC
41.6°C/W
10.7°C/W
2403 mW
(1)
The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch (7.62-mm × 7.62-mm), multilayer board with 1-ounce
(0.035-mm) internal power and ground planes and 2-ounce (0.071-mm) copper traces on the top and bottom of the board.
(2)
Mounting per the PowerPAD™ Thermally Enhanced Package application report (SLMA002).
MIN
NOM
MAX
UNIT
VIN
Supply voltage at IN
1.8
5.25
V
VSTART
Supply voltage at IN for start-up
2.2
V
Enable voltage at EN, ENUSB
0
5.25
V
TJ
Operating junction temperature range
–40
125
°C
2
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Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS2500 TPS2501


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