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TPS2501DRCT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS2501DRCT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 42 page ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS TPS2500, TPS2501 SLVS886A – OCTOBER 2008 – REVISED AUGUST 2009................................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) Eco-mode™ DEVICE TEMPERATURE(2) PACKAGE MARKING Control Scheme TPS2500 Enabled CHO –40°C to 85°C DRC (SON) TPS2501 Disabled OBA (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) Maximum ambient temperature is a function of device junction temperature and system-level considerations, such as power dissipation and board layout. See Dissipation Ratings and Recommended Operating Conditions for specific information related to these devices. over operating free-air temperature range (unless otherwise noted) VALUE UNIT Input voltage range on SW, AUX, IN, USB, ENUSB, EN, FAULT, ILIM –0.3 to 7 V FAULT sink current 25 mA ILIM source current 1 mA TJ Junction temperature range –40 to 150 °C ESD – HBM 2 kV ESD – CDM 500 V ESD – system level (contact/air)(2) 8/15 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2500EVM (HPA337) evaluation module (documentation available on the Web). These were the test levels, not the failure threshold. THERMAL RESISTANCE(2) THERMAL RESISTANCE TA ≤ 25°C PACKAGE θ JA θ JC POWER RATING DRC 41.6°C/W 10.7°C/W 2403 mW (1) The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch (7.62-mm × 7.62-mm), multilayer board with 1-ounce (0.035-mm) internal power and ground planes and 2-ounce (0.071-mm) copper traces on the top and bottom of the board. (2) Mounting per the PowerPAD™ Thermally Enhanced Package application report (SLMA002). MIN NOM MAX UNIT VIN Supply voltage at IN 1.8 5.25 V VSTART Supply voltage at IN for start-up 2.2 V Enable voltage at EN, ENUSB 0 5.25 V TJ Operating junction temperature range –40 125 °C 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS2500 TPS2501 |
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