DCU PACKAGE

(TOP VIEW)

1

8

2

7

3

6

1OE

1A

2Y

GND

4

5

V

CC

2OE

1Y

2A

RSE PACKAGE

(TOP VIEW)

1

7

2

6

8

3

5

4

V

CC

2OE

1Y

2A

GND

1OE

1A

2Y

DQE PACKAGE

(TOP VIEW)

1

8

2

7

3

6

1OE

1A

2Y

GND

4

5

V

CC

2OE

1Y

2A

1OE

1A

GND

2Y

V

CC

2OE

1Y

2A

YFP PACKAGE

(TOP VIEW)

4 5

3 6

2 7

1 8

A1

A2

B1

B2

C1

C2

D1

D2

(A)

Single, dual, and triple gates

Static-Power Consumption

AUP

AUP

3.3-V

Logic

(A)

0%

20%

40%

60%

80%

100%

Dynamic-Power Consumption

AUP

AUP

3.3-V

Logic

(A)

0%

20%

40%

60%

80%

100%

Switching Characteristics

at 25 MHz

(A)

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0

5

10

15

20

25

30

35

40

45

Time (ns)

Output

Input

L

SN74AUP2G240

www.ti.com

SCES760 – DECEMBER 2009

LOW-POWER DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

Check for Samples: SN74AUP2G240

1

FEATURES

•

Available in the Texas Instruments NanoStar™

•

Optimized for 3.3-V Operation

Package

•

3.6-V I/O Tolerant to Support Mixed-Mode

•

Low Static-Power Consumption

Signal Operation

•

•

Low Dynamic-Power Consumption

•

Suitable for Point-to-Point Applications

•

Latch-Up Performance Exceeds 100 mA Per

•

JESD 78, Class II

•

Low Noise – Overshoot and Undershoot

•

ESD Performance Tested Per JESD 22

–

2000-V Human-Body Model

•

(A114-B, Class II)

Operation

–

1000-V Charged-Device Model (C101)

•

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal

integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

Figure 1. AUP – The Lowest-Power Family

Figure 2. Excellent Signal Integrity

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2009, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.