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LSG42743 Datasheet(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LSG42743 Datasheet(HTML) 5 Page - LIGITEK electronics co., ltd. |
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5 / 5 page  4/4 Page PART NO. LSG42743 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reliability Test: Test Item Operating Life Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Thermal Shock Test Solderability Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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