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ACT108W-600E_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 9 December 2009 6 of 13 NXP Semiconductors ACT108W-600E AC Thyristor power switch 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle with heatsink compound; --15 K/W Rth(j-a) thermal resistance from junction to ambient full cycle; printed-circuit board mounted for pad area; see Figure 7 -70 - K/W full cycle; printed-circuit board mounted for minimum footprint; see Figure 8 - 156 - K/W Fig 7. Printed-circuit board pad area SOT223 Fig 8. Minimum footprint SOT223 001aab509 7 4.6 15 36 9 10 18 4.5 60 50 001aab508 3.8 min 1.5 min 1.5 min (3×) 2.3 4.6 6.3 1.5 min |
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