BAS70_1PS7XSB70_SER_9

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 09 — 13 January 2010

6 of 20

NXP Semiconductors

BAS70 series; 1PS7xSB70 series

General-purpose Schottky diodes

6.

Thermal characteristics

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Soldering point at pins 2, 3, 5 and 6.

7.

Characteristics

[1]

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from

junction to ambient

in free air

SOT23

-

-

500

K/W

SOT143B

-

-

500

K/W

SOT363 (BAS70-07S)

-

-

416

K/W

SOT666 (BAS70VV)

[2] -

-

700

K/W

SOT666 (BAS70-07V)

[2] -

-

416

K/W

SOD123F

[2] -

-

330

K/W

SOD323

-

-

450

K/W

SOD523

[2] -

-

450

K/W

SOD882

[2] -

-

500

K/W

SOT323

-

-

625

K/W

thermal resistance from

junction to solder point

SOT363 (BAS70XY)

[3] -

-

260

K/W

Table 8.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

forward voltage

-

-

410

mV

-

-

750

mV

-

-

1

V

reverse current

-

-

100

nA

-

-

10

μA

diode capacitance

-

-

2

pF