CYStech Electronics Corp.

Spec. No. : C329LC

Issued Date : 2004.06.21

Revised Date :

Page No. : 4/4

1N4148LC

CYStek Product Specification

DO-35(Glass) Dimension

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

φ0.0181 φ0.0220

φ0.46

φ0.56

D

0.9646

1.2811

24.50

32.54

B

0.9646

1.2811

24.50

32.54

E

φ0.0602 φ0.0787

φ1.53

φ2.00

C

0.1200

0.1700

3.05

4.20

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

DO-35 glass package, CYStek package code: LC