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CSMC5821 Datasheet(PDF) 1 Page - Cystech Electonics Corp. |
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CSMC5821 Datasheet(HTML) 1 Page - Cystech Electonics Corp. |
1 / 3 page CYStech Electronics Corp. Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 1/3 CSMC582XSC CYStek Product Specification 3.0Amp. Surface Mount Schottky Barrier Diodes CSMC582XSC Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, SMC/JEDEC DO-214AB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics ( Rating at 25 °C ambient temperature unless otherwise specified. ) Type Parameter Conditions Symbol CSMC 5820 CSMC 5821 CSMC 5822 Units Repetitive peak reverse voltage VRRM 20 30 40 V Maximum RMS voltage VRMS 14 21 28 V Maximum DC blocking voltage VR 20 30 40 V Maximum instantaneous forward voltage IF=3A (Note 1) VF 0.475 0.500 0.525 V Maximum average forward rectified current IO 3 A Peak forward surge current 8.3ms single half sine wave superimposed on rated load(JEDEC method) IFSM 80 A VR=VRRM,TA=25℃(Note 1) 2 mA Maximum DC reverse current VR=VRRM,TA=125℃(Note 1) IR 20 mA Maximum thermal resistance Junction to ambient(Note 2) Rth,JA 55 (typ) ℃ /w Diode junction capacitance f=1MHz and applied 4V reverse voltage CJ 300 (typ) pF Storage temperature Tstg -55~+150 ℃ Operating temperature TJ -55~+125 ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. |
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