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HITTITE |
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6 page
8 8 - 79 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC314 v02.0802 The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be con- nected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Evaluation PCB List of Material GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 0.7 - 4.0 GHz Item Description J1, J2 PC Mount SMA Connector J3, J4, J5 DC Pins U1 HMC314 PCB* 104198 Evaluation PCB 1.5” x 1.5” *Circuit Board Material: Roger 4350 |
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