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SS8046TH1TB Datasheet(PDF) 3 Page - Silicon Standard Corp. |
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SS8046TH1TB Datasheet(HTML) 3 Page - Silicon Standard Corp. |
3 / 7 page www.SiliconStandard.com 3 of 7 Rev.2.01 6/06/2003 SS8046 Electrical Characteristics VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =47µF, TA = TJ = 25°C unless otherwise specified [Note 3] PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Output Voltage IO =0.5A 3.22 3.3 3.38 V Line Regulation 4V < VIN < 7V, IO = 10mA 0.5 2 % Load Regulation 50mA < IO < 2A 0.5 2 % Quiescent Current VIN = 5V 5 10 mA Ripple Rejection fi = 120Hz, 1VP-P, IO = 100mA 45 dB Dropout Voltage IO = 2A 0.5 V Short Circuit Current 3.8 A Over Temperature 150 °C Disable Voltage High VdisH Output Active 2.0 V Disable Voltage Low VdisL Output Disabled 0.8 V Disable Bias Current High IdisH Vdis = 2.7V 20 µA Disable Bias Current Low IdisL Vdis = 0.4V 20 µA Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con- ditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θ JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θ JA. If this dissipation is exceeded, the die temperature will rise above 150°C and the device will go into thermal shutdown. For the TO 220 package, θ JA is 60°C/W (No heat sink). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The output capacitor should be a tantalum or aluminum type. Definitions Dropout Voltage The input/output voltage differential at which the regu- lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout volt- age is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af- fected. Load Regulation The change in output voltage for a change in load cur- rent at constant chip temperature. The measurement is made under conditions of low dissipation or by us- ing pulse techniques such that average chip tempera- ture is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. |
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