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SN74AUC1G07DCKTG4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AUC1G07DCKTG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 13 page www.ti.com FEATURES DBVPACKAGE (TOP VIEW) 3 2 4 5 1 NC V CC Y A GND Seemechanicaldrawingsfordimensions. DNU – Donotuse NC Nointernalconnection – V CC 3 2 4 5 1 NC Y A GND DCKPACKAGE (TOP VIEW) V CC DNU GND Y A 1 4 2 3 5 YZP PACKAGE (BOTTOMVIEW) DRY PACKAGE (TOP VIEW) A NC 6 4 2 3 GND Y V CC 1 5 NC PR EVIE W DESCRIPTION/ORDERING INFORMATION SN74AUC1G07 SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT SCES373Q – SEPTEMBER 2001 – REVISED JULY 2007 • Available in the Texas Instruments • Low Power Consumption, 10-μA Max I CC NanoFree™ Package • ±8-mA Output Drive at 1.8 V • Optimized for 1.8-V Operation and Is 3.6-V I/O • Latch-Up Performance Exceeds 100 mA Per Tolerant to Support Mixed-Mode Signal JESD 78, Class II Operation • ESD Protection Exceeds JESD 22 • I off Supports Partial-Power-Down Mode – 2000-V Human-Body Model (A114-A) Operation – 200-V Machine Model (A115-A) • Sub-1-V Operable – 1000-V Charged-Device Model (C101) • Max t pd of 2.5 ns at 1.8 V This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 SN74AUC1G07YZPR _ _ _UV_ (Pb-free) –40 °C to 85°C SON – DRY Reel of 5000 SN74AUC1G07DRYR PREVIEW SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G07DBVR U07_ SOT (SC-70) – DCK Reel of 3000 SN74AUC1G07DCKR UV_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains Copyright © 2001–2007, Texas Instruments Incorporated PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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