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SN74AUC1G80 Datasheet(PDF) 1 Page - Texas Instruments

No. de pieza SN74AUC1G80
Descripción Electrónicos  SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

SN74AUC1G80 Datasheet(HTML) 1 Page - Texas Instruments

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FEATURES
V
CC
V
CC
3
2
4
5
1
D
Q
CLK
GND
DBVPACKAGE
(TOP VIEW)
3
2
4
5
1
D
V
CC
Q
CLK
GND
D
GND
Q
CLK
Seemechanicaldrawingsfordimensions.
1
4
2
3
5
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G80
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SCES388K – MARCH 2002 – REVISED JANUARY 2007
• Available in the Texas Instruments
• Low Power Consumption, 10-µA Max I
CC
NanoFree™ Package
• ±8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V
• Latch-Up Performance Exceeds 100 mA Per
I/O Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
• Sub-1-V Operable
1000-V Charged-Device Model (C101)
• Max t
pd of 1.9 ns at 1.8 V
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Reel of 3000
SN74AUC1G80YZPR
_ _ _UX_
(Pb-free)
–40
°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74AUC1G80DBVR
U80_
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G80DCKR
UX_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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