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SN74AVC2T872 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AVC2T872 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 18 page 1 FEATURES YFP PACKAGE (TOP VIEW) 1 2 3 C B A D DESCRIPTION/ORDERING INFORMATION SN74AVC2T872 www.ti.com........................................................................................................................................................................................... SCES710 – NOVEMBER 2008 VOLTAGE-LEVEL SHIFTER FOR IC-USB INTERFACE • V CCA, VCCB Supply Voltage: 1.1 V to 3.6 V • When V CCB = 0 V, A-Port is Disabled and B-Port is Held at GND Through 120-k Ω Pulldown • Crossover Skew of <1 ns • Meets All Requirements of the IC-USB Standard • Small Package: 0.4 mm pitch WCSP 1 2 3 (1.2 mm × 1.6 mm) A PD_EN VCCA VCCB • Latch-Up Performance Exceeds 100 mA Per B D+(A) VCCA D+(B) JESD 78, Class II ESD Performance C D–(A) GND D–(B) – A-Port (Host Side) D DIR GND DIR_POL – 2000-V Human-Body Model – 1000-V Charged-Device Model – B-Port (Peripheral Side) – 8000-V Contact Discharge – 15000-V Air-Gap Discharge The SN74AVC2T872 is a 2-bit voltage level translator optimized for use in interchip USB (IC-USB) applications. VCCA and VCCB can each operate over the full range of 1.1 V to 3.6 V. The device has been designed to maintain crossover skew to be less than 1 ns. Each B-port has an integrated 120-k Ω pulldown resistor that can be enabled and disabled using the PD_EN control signal. If VCCB = 0 V, the A-port I/Os are disabled (Hi-Z) and the B-port I/Os are held to GND through the 120-k Ω resistors. If VCCA = 0 V, the A-port and B-port I/Os are disabled (Hi-Z). ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) –40°C to 85°C WCSP – YFP Reel of 3000 SN74AVC2T872YFPR _ _ _ TU _ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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