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CAT28LV64X-20T Datasheet(PDF) 3 Page - ON Semiconductor

No. de pieza CAT28LV64X-20T
Descripción Electrónicos  64 kb CMOS Parallel EEPROM
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Fabricante Electrónico  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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CAT28LV64X-20T Datasheet(HTML) 3 Page - ON Semiconductor

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CAT28LV64
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3
Figure 1. Block Diagram
CE
OE
WE
VCC
A0−A4
A5−A12
DATA POLLING
AND
TOGGLE BIT
I/O0−I/O7
ADDR. BUFFER
& LATCHES
ADDR. BUFFER
& LATCHES
INADVERTENT
CONTROL
LOGIC
TIMER
HIGH VOLTAGE
GENERATOR
I/O BUFFERS
32 BYTE PAGE
REGISTER
WRITE
PROTECTION
ROW
DECODER
COLUMN
DECODER
8,192 x 8
E2PROM
ARRAY
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Temperature Under Bias
−55 to +125
°C
Storage Temperature
−65 to +150
°C
Voltage on Any Pin with Respect to Ground (Note 1)
−2.0 V to +VCC + 2.0 V
V
VCC with Respect to Ground
−2.0 to +7.0
V
Package Power Dissipation Capability (TA = 25°C)
1.0
W
Lead Soldering Temperature (10 secs)
300
°C
Output Short Circuit Current (Note 2)
100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The minimum DC input voltage is −0.5 V. During transitions, inputs may undershoot to −2.0 V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods of less than 20 ns.
2. Output shorted for no more than one second. No more than one output shorted at a time.
Table 2. RELIABILITY CHARACTERISTICS (Note 3)
Symbol
Parameter
Test Method
Min
Max
Units
NEND
Endurance
MIL−STD−883, Test Method 1033
105
Cycles/Byte
TDR
Data Retention
MIL−STD−883, Test Method 1008
100
Years
VZAP
ESD Susceptibility
MIL−STD−883, Test Method 3015
2,000
V
ILTH (Note 4)
Latch−Up
JEDEC Standard 17
100
mA
3. These parameters are tested initially and after a design or process change that affects the parameters.
4. Latch−up protection is provided for stresses up to 100 mA on address and data pins from −1 V to VCC + 1 V.
Table 3. MODE SELECTION
Mode
CE
WE
OE
I/O
Power
Read
L
H
L
DOUT
ACTIVE
Byte Write (WE Controlled)
L
H
DIN
ACTIVE
Byte Write (CE Controlled)
L
H
DIN
ACTIVE
Standby and Write Inhibit
H
X
X
High−Z
STANDBY
Read and Write Inhibit
X
H
H
High−Z
ACTIVE


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