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CM1457 Rev. 4 | Page 6 of 9 | www.onsemi.com CM1457-04CP Mechanical Specifications The 10-bump CM1457-04CP package dimensions are shown below. Package Specifications Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max Min Nom Max A1 1.627 1.672 1.717 0.0641 0.0658 0.0676 A2 1.008 1.053 1.098 0.0397 0.0415 0.0432 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 C2 0.130 0.180 0.230 0.0051 0.0071 0.0090 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.378 0.419 0.460 0.0149 0.0165 0.0181 Controlling dimension: millimeters Package Dimensions for CM1457-04CP Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B 0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P 0 P 1 CM1457-04CP 1.67 X 1.05 X 0.615 1.80 X 1.27 X 0.73 8mm 178mm (7") 3500 4mm 4mm |
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