CSPEMI306A

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Application Information

PARAMETER

VALUE

Pad Size on PCB

0.240mm

Pad Shape

Round

Pad Definition

Non-Solder Mask defined pads

Solder Mask Opening

0.290mm Round

Solder Stencil Thickness

0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.300mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball

+50µm

Solder Ball Side Coplanarity

+20µm

Maximum Dwell Time Above Liquidous

60 seconds

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder

Paste

260°C

Solder Mask Opening

0.290mm DIA.

Non-Solder Mask Defined Pad

0.240mm DIA.

Solder Stencil Opening

0.300mm DIA.

Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile