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DESCRIPTION/ORDERING INFORMATION

DGG OR DGV PACKAGE

(TOP VIEW)

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1DIR

1B1

1B2

GND

1B3

1B4

1B5

1B6

GND

1B7

1B8

2B1

2B2

GND

2B3

2B4

2B5

2B6

GND

2B7

2B8

2DIR

1OE

1A1

1A2

GND

1A3

1A4

1A5

1A6

GND

1A7

1A8

2A1

2A2

GND

2A3

2A4

2A5

2A6

GND

2A7

2A8

2OE

The SN74AVC16T245 is designed for asynchronous communication between data buses. The device transmits

SN74AVC16T245

16-BIT DUAL-SUPPLY BUS TRANSCEIVER

WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS

SCES551C – FEBRUARY 2004 – REVISED AUGUST 2005

•

•

GND, Both Ports Are in the High-Impedance

State

•

Overvoltage-Tolerant Inputs/Outputs Allow

Mixed-Voltage-Mode Data Communications

•

Fully Configurable Dual-Rail Design Allows

Each Port to Operate Over the Full 1.2-V to

3.6-V Power-Supply Range

•

Operation

•

I/Os Are 4.6-V Tolerant

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 8000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

This 16-bit noninverting bus transceiver uses two

separate

configurable

power-supply

rails.

The

SN74AVC16T245

is

optimized

to

operate

with

This allows for universal low-voltage bidirectional

translation between any of the 1.2-V, 1.5-V, 1.8-V,

2.5-V, and 3.3-V voltage nodes.

data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the

direction-control (DIR) input. The output-enable (OE) input can be used to disable the outputs so the buses

effectively are isolated.

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

TSSOP – DGG

Tape and reel

SN74AVC16T245DGGR

AVC16T245

TVSOP – DGV

Tape and reel

SN74AVC16T245DGVR

WF245

–40

°C to 85°C

VFBGA – GQL

SN74AVC16T245GQLR

Tape and reel

WF245

VFBGA – ZQL (Pb-free)

SN74AVC16T245ZQLR

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2004–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.