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ISL54226IRZEVAL1Z Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL54226IRZEVAL1Z Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 18 page ISL54226 4 FN7614.0 July 29, 2010 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V VDD to COMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V COMx to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.6V Input Voltages D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V COM+, COM- . . . . . . . . . . . . . . . . . . . . . . . -5V to 6.5V OE/ALM . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.5V Continuous Current (COM - / D-, COM + / D+) . . . . ±40mA Peak Current (COM-/D-, COM+/D+) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA ESD Rating: Human Body Model (Tested per JESD22-A114-F). . . . >2kV Machine Model (Tested per JESD22-A115-A) . . . . . . >150V Charged Device Model (Tested per JESD22-C101-D) . >2kV Latch-up (Tested per JEDEC; Class II Level A) . . . . at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld µTQFN Package (Notes 7, 9). . 210 165 8 Ld TDFN Package (Notes 6, 8). . . 96 19 Maximum Junction Temperature (Plastic Package). . +150°C Maximum Storage Temperature Range. . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Normal Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C VDD Supply Voltage Range . . . . . . . . . . . . . . 2.7V to 5.25V Logic Control Input Voltage . . . . . . . . . . . . . . . 0V to 5.25V Analog Signal Range VDD = 2.7V to 5.25V . . . . . . . . . . . . . . . . . . . 0V to 3.6V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 9. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VOE/ALMH =1.4V, VOE/ALML = 0.5V, (Note 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Notes 11, 12) TYP MAX (Notes 11, 12) UNITS ANALOG SWITCH CHARACTERISTICS ON-Resistance, rON (High-Speed) VDD = 2.7V, OE/ALM = 1.4V, IDx =17mA, VCOM+ or VCOM- = 0V to 400mV (see Figure 2, Note 15) 25 - 3.5 5 Ω Full - - 7 Ω rON Matching Between Channels, ΔrON (High-Speed) VDD = 2.7V, OE/ALM = 1.4V, IDx =17mA, VCOM+ or VCOM- = Voltage at max rON, (Notes 14, 15) 25 - 0.2 0.45 Ω Full - - 0.55 Ω rON Flatness, RFLAT(ON) (High-Speed) VDD = 2.7V, OE/ALM = 1.4V, IDx =17mA, VCOM+ or VCOM- = 0V to 400mV, (Notes 13, 15) 25 - 0.26 1 Ω Full - - 1.2 Ω ON-Resistance, rON VDD = 3.3V, OE/ALM = 1.4V, ICOMx = 17mA, VCOM+ or VCOM-= 3.3V (see Figure 2, Note 15) +25 - 6.8 17 Ω Full - - 22 Ω OFF Leakage Current, IDx(OFF) VDD = 5.25V, OE/ALM = 0V, VDx = 0.3V, 3.3V, VCOMX = 3.3V, 0.3V 25 -20 1 20 nA Full - 30 - nA ON Leakage Current, IDx(ON) VDD = 5.25V, OE/ALM = 5.25V, VDx = 0.3V, 3.3V, VCOMX = 0.3V, 3.3V 25 -9 - 9 µA Full -12 - 12 µA Power OFF Leakage Current, ICOM+, ICOM- VDD = 0V, VCOM+ = 5.25V, VCOM- = 5.25V, OE/ALM = 0V 25 - - 11 µA Power OFF Logic Current, IOE/ALM VDD = 0V, OE/ALM = 5.25V 25 - - 22 µA Power OFF D+/D- Current, ID+, ID- VDD = 0V, OE/ALM = VDD, VD+ =VD- = 5.25V 25 - - 1 µA |
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