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ISL54200IRZ-T Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL54200IRZ-T Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 18 page ISL54200 4 FN6408.2 June 17, 2010 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V Input Voltages FSD2, FSD1, HSD2, HSD1 (Note 6) . - 1V to ((VDD) +0.3V) IN, EN (Note 6) . . . . . . . . . . . . . . -0.3V to ((VDD) +0.3V) Output Voltages COMD1, COMD2 (Note 6) . . . . . . . . . . . . . . . . . -1V to 5V Continuous Current (HSD2, HSD1, FSD2, FSD1) . . . ±40mA Peak Current (HSD2, HSD1, FSD2, FSD1) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA ESD Rating: HBM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >7kV MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >400V CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1.4kV Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld µTQFN (Notes 7, 8) . . . . . . . 145 90 10 Ld TDFN (Notes 9, 10) . . . . . . . 55 16.5 Maximum Junction Temperature (Plastic Package). . +150°C Maximum Storage Temperature Range. . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C VDD Supply Voltage Range . . . . . . . . . . . . . . . 2.7V to 5.5V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. Signals on FSD1, FSD2, HSD1, HSD2, COMD1, COMD2, EN, IN exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings. 7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For θJC, the “case temp” location is taken at the package top center. 9. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 10. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VENH = 1.4V, VENL = 0.5V, (Note 11), Unless Otherwise Specified. Bold- face limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Notes 12, 13) TYP MAX (Notes 12, 13) UNITS ANALOG SWITCH CHARACTERISTICS NC Switches (FSD1, FSD2) Analog Signal Range, VANALOG VDD = 3.3V, IN = 0V, EN = 3.3V Full 0 - VDD V ON-Resistance, rON VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA, VFSD1 or VFSD2 = 0V to 3.3V, (See Figure 4) +25 - 7 10 Ω Full - - 15 Ω rON Matching Between Channels, ΔrON VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA, VFSD1 or VFSD2 = Voltage at max rON over signal range of 0V to 3.3V, (Note 15) +25 - 0.1 0.35 Ω Full - - 0.4 Ω rON Flatness, rFLAT(ON) VDD = 3.3V, IN = 0.5V, EN = 1.4V, ICOMx = 40mA, VFSD1 or VFSD2 = 0V to 3.3V, (Note 14) +25 - 4 6 Ω Full - - 8 Ω OFF Leakage Current, IFSX(OFF) V+ = 3.6V, IN = 3.6V, EN = 0V and 3.6V, VCOMx = 0.3V, 3V, VFSX = 3V, 0.3V +25 -20 2 20 nA Full -70 - 70 nA ON Leakage Current, IFSX(ON) V+ = 3.6V, IN = 0V, EN = 3.6V, VCOMx = 0.3V, 3V, VFSX = 0.3V, 3V +25 -20 2 20 nA Full -70 - 70 nA NO Switches (HSD1, HSD2) Analog Signal Range, VANALOG VDD = 3.3V, IN = 3.3V, EN = 3.3V Full 0 - VDD V ISL54200 |
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