10

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6526.1

June 24, 2008

Thermal Management

The power dissipation of ISL55016 is about 500mW. The

recommended layout is shown in Figure 31. The ground pad

should be placed under the bottom of the device. At least

two thermal vias are needed to lower the temperature.

Choices of Components

ISL55016 is designed for wide bandwidth applications, from

50MHz to 3GHz. The decoupling and RF choke components

should be chosen carefully for different frequency

applications. Tables 1 and 2 list the components used on the

evaluation board.

Evaluation Board Setup

The Evaluation board is designed to connect directly to the

2-way 180° Power combiner to recombine signals from

-2GHz and allow single-ended assessment with good phase

matching the two differential signals into one single-ended

output. For lower frequencies, a different choice of power

combiner is needed and short matched coaxial cables

should be used to connect to the combiner. This setup is

used on noise figure measurement and differential

OIP2/OIP3 measurements.

TABLE 1. LIST OF COMPONENTS (50MHz~300MHz)

FREQUENCY BAND

VALUE

DESCRIPTION/

DIMENSIONS

C1, C2

2200pF

0603

C4, C5

2200pF

0603

L1, L2

2.2µH

Multilayer

Ferrite/0603

C3

1nF

0603

C6

0.1µF

1206

R1, R2

27

Ω/0Ω

0402

FIGURE 32. |S11| vs FREQUENCY

-30

-25

-20

-15

-10

-5

0

0

0.5G

1.0G

1.5G

2.5G

3.0G

FREQUENCY (Hz)

2.0G

EVAL BOARD WITH

MATCHING NETWORK

PROBE STATION

TABLE 2. LIST OF COMPONENTS (300MHz~3GHz)

FREQUENCY BAND

VALUE

DESCRIPTION/

DIMENSIONS

C1, C2

100pF

0603

C4, C5

100pF

0603

L1, L2

100nH

Surface

Mount/0402

C3

100pF

0603

C6

0.1µF

1206

R1, R2

27

Ω/0Ω

0402

FIGURE 33. EVALUATION BOARD WITH 2-WAY 180° POWER

COMBINER

1

2

3

6

5

4

ISL55016

C1

C2

C5

C4

RF

C3

L1

L2

R2

R1

+5V

C6

1

2

s

180°

POWER

COMBINER

DIFFERENTIAL

SIGNAL

OUTPUT

ISL55016