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ISL55016IRTZ-T7 Datasheet(PDF) 10 Page - Intersil Corporation |
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ISL55016IRTZ-T7 Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 11 page 10 All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6526.1 June 24, 2008 Thermal Management The power dissipation of ISL55016 is about 500mW. The recommended layout is shown in Figure 31. The ground pad should be placed under the bottom of the device. At least two thermal vias are needed to lower the temperature. Choices of Components ISL55016 is designed for wide bandwidth applications, from 50MHz to 3GHz. The decoupling and RF choke components should be chosen carefully for different frequency applications. Tables 1 and 2 list the components used on the evaluation board. Evaluation Board Setup The Evaluation board is designed to connect directly to the 2-way 180° Power combiner to recombine signals from -2GHz and allow single-ended assessment with good phase matching the two differential signals into one single-ended output. For lower frequencies, a different choice of power combiner is needed and short matched coaxial cables should be used to connect to the combiner. This setup is used on noise figure measurement and differential OIP2/OIP3 measurements. TABLE 1. LIST OF COMPONENTS (50MHz~300MHz) FREQUENCY BAND VALUE DESCRIPTION/ DIMENSIONS C1, C2 2200pF 0603 C4, C5 2200pF 0603 L1, L2 2.2µH Multilayer Ferrite/0603 C3 1nF 0603 C6 0.1µF 1206 R1, R2 27 Ω/0Ω 0402 FIGURE 32. |S11| vs FREQUENCY -30 -25 -20 -15 -10 -5 0 0 0.5G 1.0G 1.5G 2.5G 3.0G FREQUENCY (Hz) 2.0G EVAL BOARD WITH MATCHING NETWORK PROBE STATION TABLE 2. LIST OF COMPONENTS (300MHz~3GHz) FREQUENCY BAND VALUE DESCRIPTION/ DIMENSIONS C1, C2 100pF 0603 C4, C5 100pF 0603 L1, L2 100nH Surface Mount/0402 C3 100pF 0603 C6 0.1µF 1206 R1, R2 27 Ω/0Ω 0402 FIGURE 33. EVALUATION BOARD WITH 2-WAY 180° POWER COMBINER 1 2 3 6 5 4 RFIN ISL55016 C1 C2 C5 C4 RFOUT RF C3 L1 L2 R2 R1 +5V C6 1 2 s 180° POWER COMBINER DIFFERENTIAL SIGNAL OUTPUT ISL55016 |
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