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BCW72LT1G Datasheet(PDF) 1 Page - ON Semiconductor |
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BCW72LT1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 7 page © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 3 1 Publication Order Number: BCW72LT1/D BCW72LT1G General Purpose Transistor NPN Silicon Features • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO 45 Vdc Collector−Base Voltage VCBO 50 Vdc Emitter−Base Voltage VEBO 5.0 Vdc Collector Current − Continuous IC 100 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W Junction and Storage Temperature TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 x 0.75 x 0.062 in. 2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. http://onsemi.com SOT−23 (TO−236) CASE 318 STYLE 6 Device Package Shipping† ORDERING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. BCW72LT1G SOT−23 (Pb−Free) 3,000 / Tape & Reel 1 2 3 *Date Code orientation and/or overbar may vary depending upon manufacturing location. 1 K2 M G G K2 = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) MARKING DIAGRAM COLLECTOR 3 1 BASE 2 EMITTER |
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