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FAN2564UC18X Datasheet(PDF) 4 Page - Fairchild Semiconductor

No. de pieza FAN2564UC18X
Descripción Electrónicos  300mA Low VIN LDO for Digital Applications
Download  13 Pages
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Fabricante Electrónico  FAIRCHILD [Fairchild Semiconductor]
Página de inicio  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN2564UC18X Datasheet(HTML) 4 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2564 • Rev. 1.0.2
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be oper-
able above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VIN
Input Voltage with Respect to GND
-0.3
4.5
V
Voltage on Any Other Pin with Respect to GND
-0.3
VIN
V
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Temperature (Soldering 10 Seconds)
+260
°C
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
4
kV
Charged Device Model per JESD22-C101
2
Machine Model per JESD22-A115
200
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Supply Voltage Range
1.8
3.6
V
IOUT
Output Current
0
300
mA
CIN
Input Capacitor
1.0
µF
COUT
Output Capacitor
1.0
4.7
10.0
µF
TA
Operating Ambient Temperature
-40
+85
°C
TJ
Operating Junction Temperature
-40
+125
°C
Thermal Properties
Symbol
Parameter
Min.
Typ.
Max.
Units
ΘJA
Junction-to-Ambient Thermal Resistance
(2)
WLSCP
200
°C/W
UMLP
49
°C/W
Note:
2.
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured
with four-layer 2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to
exceed junction temperature TJ(max) at a given ambient temperate TA.


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