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ISL22346 Datasheet(PDF) 3 Page - Intersil Corporation |
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ISL22346 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 16 page 3 FN6177.2 September 3, 2009 15 17 A1 Device address input for the I2C interface 16 18 VCC Power supply pin 17 19 SHDN Shutdown active low input 18 20 RH0 “High” terminal of DCP0 19 1 RL0 “Low” terminal of DCP0 20 2 RW0 “Wiper” terminal of DCP0 EPAD* Exposed Die Pad internally connected to GND *Note: PCB thermal land for QFN EPAD should be connected to GND plane or left floating. For more information refer to http://www.intersil.com/data/tb/TB389.pdf Pin Descriptions (Continued) TSSOP PIN NUMBER TQFN PIN NUMBER PIN NAME DESCRIPTION ISL22346 |
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