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BD3925HFP-C Datasheet(PDF) 7 Page - Rohm

No. de pieza BD3925HFP-C
Descripción Electrónicos  Voltage Tracker
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Fabricante Electrónico  ROHM [Rohm]
Página de inicio  http://www.rohm.com
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BD3925HFP-C Datasheet(HTML) 7 Page - Rohm

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Technical Note
7/9
BD3925FP-C,BD3925HFP-C
www.rohm.com
2011.03 - Rev.B
© 2011 ROHM Co., Ltd. All rights reserved.
Notes for use
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a
special mode where the absolute maximum ratings may be exceeded is anticipated.
2. GND potential
Ensure a minimum GND pin potential in all operating conditions.
3. Thermal design
The Power dissipation indicated on this specification is the value without heat sink. Use a thermal design that allows for a
sufficient margin by attaching with heat sink in light of the power dissipation (Pd) in actual operating conditions.
4. Pin short and mistake mounting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins and the power supply and GND pins caused by the presence of a foreign
object may result in damage to the IC. Ensure a minimum GND pin potential in all operating conditions.
5. Actions in strong magnetic field
Keep in mind that the IC may malfunction in strong magnetic fields
6. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure, and use similar caution when transporting or storing the IC
7. Ground patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application’s reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external parts, either.
8. Applications or inspection processes where the potentials of the Vcc pin and other pins may be reversed from their
normal states may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 470µF or
lower in case Vcc is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a diode
for preventing back current flow in series with Vcc or bypass diodes between Vcc and each pin.
9. SW Pin, ADJ Pin
Do not apply the voltage to SW pin and ADJ pin when the Vcc is not applied.
And when the Vcc is applied, the voltage of SW pin and ADJ pin must not exceed Vcc.
10. Thermal shutdown circuit (TSD)
This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the
specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power
dissipation limits, the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all output power
elements(175℃:Typ). The circuit automatically resets once the junction temperature (Tj) drops (150℃:Typ). Operation of
the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never
make use of the TSD circuit.
11. Overcurrent protection circuit (OCP)
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity.
This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit
current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or
other component. This protection circuits is effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative characteristics to
temperatures.
Vcc
Pin


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