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BD3925HFP-C Datasheet(PDF) 7 Page - Rohm |
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BD3925HFP-C Datasheet(HTML) 7 Page - Rohm |
7 / 10 page Technical Note 7/9 BD3925FP-C,BD3925HFP-C www.rohm.com 2011.03 - Rev.B © 2011 ROHM Co., Ltd. All rights reserved. ● Notes for use 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2. GND potential Ensure a minimum GND pin potential in all operating conditions. 3. Thermal design The Power dissipation indicated on this specification is the value without heat sink. Use a thermal design that allows for a sufficient margin by attaching with heat sink in light of the power dissipation (Pd) in actual operating conditions. 4. Pin short and mistake mounting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. Ensure a minimum GND pin potential in all operating conditions. 5. Actions in strong magnetic field Keep in mind that the IC may malfunction in strong magnetic fields 6. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC 7. Ground patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application’s reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external parts, either. 8. Applications or inspection processes where the potentials of the Vcc pin and other pins may be reversed from their normal states may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 470µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. It is recommended to insert a diode for preventing back current flow in series with Vcc or bypass diodes between Vcc and each pin. 9. SW Pin, ADJ Pin Do not apply the voltage to SW pin and ADJ pin when the Vcc is not applied. And when the Vcc is applied, the voltage of SW pin and ADJ pin must not exceed Vcc. 10. Thermal shutdown circuit (TSD) This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the junction temperature (Tj) will trigger the TSD circuit to turn off all output power elements(175℃:Typ). The circuit automatically resets once the junction temperature (Tj) drops (150℃:Typ). Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the TSD circuit. 11. Overcurrent protection circuit (OCP) The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. This protection circuits is effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative characteristics to temperatures. Vcc Pin |
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