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TS8542VA Datasheet(PDF) 1 Page - Vishay Siliconix |
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TS8542VA Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 4 page TS8542VA www.vishay.com Vishay Semiconductors Rev. 1.1, 20-Feb-12 1 Document Number: 83474 For technical questions, contact: optochipsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Specification of High Power IR Emitting Diode Chip DESCRIPTION TS8542VA is a high power infrared, 850 nm surface emitting diode in GaAlAs technology with high radiant power and high speed. Polarity Confoguration is “n-up”. FEATURES • Package type: chip • Package form: single chip • Technology: surface emitter • Dimensions chip (L x W x H in mm): 1.066 x 1.066 x 0.17 • Peak wavelength: λ = 850 nm • Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC GENERAL INFORMATION The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore sold die may not perform on an equivalent basis to standard package products. Note • Test condition see table “Basic Characteristics” Note • MOQ: minimum order quantity PRODUCT SUMMARY COMPONENT fe (mW) ϕ (deg) λp (nm) tr (ns) TS8542VA 350 55 850 15 ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TS8542VA-SF-F Wafer sawn on foil MOQ: 5000 pcs Chip ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Forward current IF 1A Reverse voltage VR 5V Surge forward current tp = 100 μs IFSM 5A Junction temperature Tj 140 °C Storage temperature range chip Tstg1 - 40 to + 125 °C Storage temperature range on foil Tstg2 - 20 to + 65 °C Temperature during packaging tp < 10 s 280 °C |
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