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SM802121UMG Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SM802121UMG Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 10 page Micrel, Inc. SM802121 January 2012 4 M9999-011212-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDO) .........................................+4.6V Input Voltage (VIN)...............................0.50V to VDD + 0.5V Lead Temperature (soldering, 20s)............................ 260°C Case Temperature ..................................................... 115°C Storage Temperature (Ts) ......................... 65C to 150°C Operating Ratings (2) Supply Voltage (VDD, VDDO).................. +2.375V to +3.465V Ambient Temperature (TA).......................... 40°C to +85°C Junction Thermal Resistance (3) QFN ( JA) Still-Air......................................................... 50°C/W QFN ( JB) Junction-to-Board ....................................... 30°C/W DC Electrical Characteristics (4) VDD = VDDO = 3.3V 5% or 2.5V 5% VDD = 3.3V 5%, VDDO= 3.3V 5% or 2.5V 5% TA = 40C to 85C. Symbol Parameter Condition Min. Typ. Max. Units VDD, VDDO 2.5V Operating Voltage 2.375 2.5 2.625 V VDD, VDDO 3.3V Operating Voltage 3.135 3.3 3.465 V IDD Supply Current VDD + VDDO XTAL_SEL = 0; REF_IN source, outputs open 78 100 mA IDD Supply Current VDD + VDDO XTAL_SEL = 1; CRYSTAL source, outputs open 88 114 mA LVPECL DC Electrical Characteristics (4) VDD = VDDO= 3.3V 5% or 2.5V 5% VDD = 3.3V 5%, VDDO = 3.3V 5% or 2.5V 5% TA = 40C to 85C. RL = 50Ω to VDDO 2V Symbol Parameter Condition Min. Typ. Max. Units VOH Output High Voltage VDDO 1.145 VDDO 0.97 VDDO 0.845 V VOL Output Low Voltage VDDO 1.945 VDDO 1.77 VDDO 1.645 V VSWING Output Voltage Swing 0.6 0.8 1.0 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established. |
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