TPS3705xx

TPS3707xx

PROCESSOR SUPERVISORY CIRCUITS WITH POWERFAIL

SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005

5

POST OFFICE BOX 655303

TPS370xY chip information

These chips, when properly assembled, display characteristics similar to those of the TPS370x. Thermal

compression or ultrasonic bonding may be caused on the doped-aluminum bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

TPS3705Y

TPS3707Y

(1)

(2)

(3)

(8)

(6)

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 10 MILS TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

46

50

(4)

(7)

(5)

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

MR

1

I

Manual reset

VDD

2

Supply voltage

GND

3

Ground

PFI

4

I

Power-fail comparator input

PFO

5

O

Power-fail comparator output

WDI

TPS3705

6

I

Watchdog timer input

NC

TPS3707

6

No internal connection

RESET

7

O

Active-low reset output

WDO

TPS3705

8

O

Watchdog timer output

RESET

TPS3707

8

O

Active-high reset output