ESD7381MUT5G datasheet(1/5 Pages) ONSEMI

No. de pieza	ESD7381MUT5G

Descripción Electrónicos	Transient Voltage Suppressors Micro.Packaged Diodes for ESD Protection

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Fabricante Electrónico	ONSEMI [ON Semiconductor]

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July, 2012 − Rev. 2

1

Publication Order Number:

ESD7381/D

ESD7381MUT5G

Transient Voltage

Suppressors

Micro−Packaged Diodes for ESD Protection

The ESD7381 is designed to protect voltage sensitive components

that require ultra−low capacitance from ESD and transient voltage

events. Excellent clamping capability, low capacitance, low leakage,

and fast response time, make these parts ideal for ESD protection on

designs where board space is at a premium. Because of its low

capacitance, it is suited for use in high frequency designs such as

USB 2.0 high speed and antenna line applications.

Features

• Ultra−Low Capacitance: 0.37 pF

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.60 mm x 0.30 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 3.3 V

• Low Leakage

• Insertion Loss: 0.030 dBm

• Response Time is < 1 ns

• Low Dynamic Resistance < 1 W

• IEC61000−4−2 Level 4 ESD Protection

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• RF Signal ESD Protection

• RF Switching, PA, and Antenna ESD Protection

• Near Field Communications

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

±20

kV

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

250

400

mW

°C/W

Junction and Storage Temperature Range

TJ, Tstg

−40 to +125

°C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Device

Package

Shipping†

ORDERING INFORMATION

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

ESD7381MUT5G

X3DFN2

(Pb−Free)

5000/Tape & Reel

X3DFN2

CASE 152AF

MARKING

DIAGRAM

1

Cathode

2

Anode

PIN 1

E

= Specific Device Code

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