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74CBTLV3861 Datasheet(PDF) 2 Page - NXP Semiconductors |
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74CBTLV3861 Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 18 page 74CBTLV3861 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 16 December 2011 2 of 18 NXP Semiconductors 74CBTLV3861 10-bit bus switch with output enable 3. Ordering information [1] Also known as QSOP24 package 4. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74CBTLV3861DK 40 C to +125 C SSOP24[1] plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm SOT556-1 74CBTLV3861PW 40 C to +125 C TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 74CBTLV3861BQ 40 C to +125 C DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 5.5 0.85 mm SOT815-1 Fig 1. Logic symbol 001aan142 A1 OE B1 2 22 23 A2 B2 3 21 A3 B3 4 20 A4 B4 5 19 A5 B5 6 18 A6 B6 7 17 A7 B7 8 16 A8 B8 9 15 A9 B9 10 14 A10 B10 11 13 Fig 2. Logic diagram (one switch) 001aan143 nB nA OE |
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