®

BUF634

3

PIN CONFIGURATION

Top View

8-Pin Dip Package

SO-8 Surface-Mount Package

Top View

Supply Voltage .....................................................................................

±18V

Input Voltage Range ...............................................................................

±V

S

Output Short-Circuit (to ground) ................................................. Continuous

Operating Temperature ..................................................... –40

°C to +125°C

Storage Temperature ........................................................ –55

°C to +125°C

Junction Temperature ....................................................................... +150

°C

Lead Temperature (soldering,10s) .................................................... +300

°C

NC = No Connection

BW

NC

V

IN

V–

NC

V+

V

O

NC

1

2

3

4

8

7

6

5

G = 1

Any integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet

published specifications.

ELECTROSTATIC

DISCHARGE SENSITIVITY

NOTE: Tab electrically

connected to V–.

G = 1

G = 1

V–

V

O

V+

V

IN

BW

123 4 5

5-Lead

TO-220

V–

V

O

V+

V

IN

BW

123 4 5

5-Lead DDPAK

Surface Mount

PACKAGE

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

BUF634P

8-Pin Plastic DIP

006

–40

°C to +85°C

BUF634U

SO-8 Surface-Mount

182

–40

°C to +85°C

BUF634T

5-Lead TO-220

315

–40

°C to +85°C

BUF634F

5-Lead DDPAK

325

–40

°C to +85°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS